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Supermicro® FatTwin™ Delivers 16% Net Power Savings to Transform the HPC Landscape

- Company's Innovations in Green Server and Storage Solutions Open New Paths to Exascale Computing at Supercomputing 2012

SALT LAKE CITY, Nov. 12, 2012 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server technology and green computing, will showcase its expansive lineup of SuperServer®, SuperStorage and networking solutions geared for high performance computing (HPC) at Supercomputing 2012 (SC12) in Salt Lake City, Utah, November 12-15. Supermicro is also showing its latest FatTwin platforms which provide the industry's highest density in storage of 8x 3.5" HDDs in 1U, and 12x highly parallel processing, double-width GPU/MIC cards in 4U. The FatTwin platform utilizes a shared resource power saving architecture with high-efficiency 8cm heavy-duty cooling fans, optimized airflow and Platinum Level (94%+) power supplies, which combine to deliver 16% higher energy efficiency than the competition. The company is making innovative strides across all areas of its platforms from free-air cooling designs able to operate at up to 47 degrees C ambient temperatures to expanded deployment of cost-effective Battery Backup Power (BBP™) modules which can replace traditional UPS systems offering up to 99% energy efficiency for high-availability applications.

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"Forces have aligned this year to deliver a successive wave of computing advances leading up to Supercomputing 2012," said Charles Liang, President and CEO of Supermicro. "We have many cutting edge innovations launching simultaneously for HPC applications at SC12. From our expanding line of FatTwin SuperServers delivering 16% net power savings to energy-efficient free-air cooling support for new CPUs, GPUs, PCI-E based Intel Xeon Phi coprocessors, SSD technology and wider deployment of high-speed 10GbE and low-latency IB-FDR network connectivity, Supermicro is raising the performance bar while reducing our impact on the planet across our entire product line. Our commitment to deliver the most advanced, energy efficient, green computing technologies to HPC communities is creating a new path to exascale supercomputing and truly transforms today's High Performance Computing landscape."

Highlights include Supermicro's new, innovative 4U FatTwin™ featuring 8/4 node front or rear I/O configurations and a new model supporting up to 12x GPU/MIC based cards in 4U for the most compute intensive applications. A wide range of X9 SuperServer® and highest compute density SuperBlade® solutions support the latest NVIDIA® Kepler K20 GPU and new Intel® Xeon Phi™ coprocessor technologies offering massive parallel processing power for highly scalable, clusterable supercomputing solutions. Supermicro's SuperBlade solutions feature high speed FDR InfiniBand, 10Gb Ethernet and FCoE switches. New Hyper-Speed server/4U Tower solutions targeting HFT and computational finance applications are optimized for enhanced speed of dual high-performance (150W TDP) CPUs while maintaining complete stability and reliability with intelligent monitoring, custom cooling and board-level failsafe technology. SuperWorkstations with NVIDIA® Maximus™ certification combining the industry's highest quantity of GPUs (up to 5x) for simultaneous, real-time visualization and interactive design capability in a single workstation. Additional solutions include a new 3U 12x hot-plug node MicroCloud SuperServer for high density Cloud computing, Twin architecture based SuperServers featuring maximum power savings and efficiency with uncompromised performance, high-density, high capacity SuperStorage with up to 88x 2.5" hot-swap HDDs in 4U Double-Sided Storage® models and Supermicro's exclusive redundant Battery Backup Power (BBP™) module technology that increases overall power efficiency and cost savings over traditional UPS systems.

Supermicro's HPC servers offer maximum performance and expandability. Built on Supermicro's 4-way MP, 2-way DP and single processor UP X9 motherboard configurations, these platforms support Intel Xeon processor E5-4600, E5-2600, E5-2400 product families. A+ motherboards in MP/DP/UP configurations support the latest AMD Opteron 6300 series processors. Up to 1TB of memory is supported with a variety of PCI-E 3.0 configurations, high speed I/O with 10GbE and InfiniBand FDR onboard and add-on cards options are also available. With 14U and 42U fully integrated SuperRack® solutions, a comprehensive lineup of 1Gb and 10Gb top-of-rack Ethernet switches and remote Data Center management software (SDCM) suite, Supermicro delivers total supercomputing clusters ready for the Exascale era.

Visit Supermicro at SC12, November 12-15 in Salt Lake City, Utah. Stop by booth #817 in the Salt Palace Convention Center to see a complete lineup of Supermicro's HPC optimized server and storage solutions. Supermicro, AMD and Silicon Mechanics proudly support the Massachusetts Green High-Performance Computing Consortium Team at the SC12 Student Cluster Competition, see info here.

For more information on Supermicro's wide range of high performance, high-efficiency SuperServer and SuperStorage solutions, visit

Follow Supermicro on Facebook and Twitter to receive their latest news and announcements.

About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, SuperServer and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

Intel, the Intel logo, the Intel Inside logo, Xeon, and Xeon Phi are trademarks of Intel Corporation in the U.S. and other countries.

AMD, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc.


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