|By PR Newswire||
|November 13, 2012 07:25 AM EST||
PITTSBURGH, Nov. 13, 2012 /PRNewswire/ -- Building upon its comprehensive portfolio of advanced multiphysics engineering simulation technology, ANSYS (NASDAQ: ANSS) today released version 14.5 to further support an integrated and streamlined approach to design exploration and the creation of a complete virtual prototype. New multiphysics capabilities are seamlessly brought together with the ANSYS Workbench platform to deliver unmatched engineering productivity and innovation.
In the real world, product performance varies by operating conditions, consumer usage, manufacturing processes and material properties. As products become increasingly complex, it is more challenging for engineers to fully understand the performance implications of design variations. Multiphysics simulation technology enables companies to make informed decisions based on insight gained from these analyses to deliver optimal results. Built on a platform that streamlines workflow among simulation applications, ANSYS 14.5 delivers many new and critical multiphysics solutions, enhancements to pre-processing and meshing capabilities as well as a new parametric high-performance computing (HPC) licensing model to make design exploration more scalable.
"It's no secret that while today's products are getting smarter, they're also becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers."
NEW PARAMETRIC LICENSING SOLUTIONS FOR DESIGN EXPLORATION
ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports robust design exploration via a combination of Workbench's enhanced parametric simulation technology with improved job management and a new HPC licensing solution that enables scalable throughput computing.
Specifically, the new HPC Parametric Pack amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing), enabling simultaneous execution of multiple design points while consuming just one set of application licenses.
CHIP–PACKAGE–SYSTEM DESIGN FLOW
To meet increasing market demands of higher performance, smaller size and lower-cost electronics, the design of electronic chips, packages and systems requires an integrated analysis and verification methodology. To resolve these challenges, ANSYS 14.5 introduces the first chip–package–system (CPS) design flow on the market. This coupled approach addresses multidisciplinary requirements from the first phase of the design process and results in a final product whose individual components work together as an integrated system.
ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's integrated circuit (IC) power analysis products to ANSYS' electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave™ to IC power simulations in Apache's RedHawk™ and Totem™ for increased convenience.
ADVANCED MESHING SOLUTIONS
Users of ANSYS 14.5 can create higher-fidelity simulation results faster. ANSYS TGrid™ functionalities are integrated in the ANSYS Fluent® environment in version 14.5 to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment. Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time.
COMPLEX 3-D COMPOSITES SHAPE SIMULATION
The use of composites parts across different industries is growing due to their ability to reduce the weight of a product. While many composites can be efficiently modeled as thin structures, some complex geometries, such as turbine blades, pressure vessels and automotive structures, require the setup of 3-D models and their inclusion within larger assemblies made of non-composites parts. ANSYS Workbench provides the necessary framework and streamlined workflow in version 14.5 to further improve the ability to create 3-D layered composites from complex geometry and conveniently combine them with non-composites parts in global assemblies.
EXTENDED FLUID–THERMAL MULTIPHYSICS CAPABILITIES
Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces extended fluid–thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell®. The ANSYS Workbench platform supports the efficient coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers.
A holistic solution for one-way thermal–fluid–structure interaction (FSI), ANSYS system coupling supports a wide variety of one-way thermal FSI workflows, which promotes higher-fidelity simulations. Furthermore, the robustness of coupled two-way force/displacement FSI is enhanced, allowing engineers to gain insight into their complete products more quickly and with less hassle. A global liquid food packaging and processing leader, Tetra Pak, has seen marked improvements with 14.5's new two-way FSI capabilities:
"Historically, simulating two-way FSI has been an incredibly time-consuming and complex process and, in some applications, not even possible," said Ulf Lindblad, technology specialist at Tetra Pak. "The solution stabilization algorithm implemented in ANSYS 14.5 broadens the range of applications where we can execute this difficult task with increased accuracy and efficiency. Designing our systems with optimized FSI will ultimately lead to improved machine performance for our customers and improved package performance for their consumers."
ESTEREL TECHNOLOGIES SCADE SUITE® COUPLING WITH ANSYS SIMPLORER®
A systems-level engineering approach that brings hardware and software together earlier in the design process is crucial to avoiding design errors being introduced at a point when changes are costly.
With the integration of recently acquired ANSYS subsidiary Esterel Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical and fluidic subsystems. This capability increases the design fidelity and boosts confidence that products will perform as expected in the real world.
ANSYS HFSS™ FOR ECAD INTEGRATION
As companies face pressure to do more with their current engineering resources, ANSYS 14.5 further streamlines the design workflow and introduces ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.
Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC, has chosen to switch to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a competitor's electromagnetic modeling and simulation products for nearly 10 years. "After a two-year extensive evaluation and measurement correlation of the ANSYS tools against multiple industry products, the measurement comparisons have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures. We found through detailed measurement testing that HFSS is truly the 'golden standard' in electromagnetic modeling. When the structures we measured were modeled faithfully and the material properties were characterized and entered accurately, ANSYS HFSS produced extremely accurate results with no discernible difference between measured and modeled results."
ANSYS version 14.5 is available for download via the ANSYS Customer Portal: https://www1.ansys.com/customer/default.asp
Related images are available for download by the media at: http://www.ansys.com/newsimages
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs approximately 2,400 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 65 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
SOURCE ANSYS, Inc.
There are several IoTs: the Industrial Internet, Consumer Wearables, Wearables and Healthcare, Supply Chains, and the movement toward Smart Grids, Cities, Regions, and Nations. There are competing communications standards every step of the way, a bewildering array of sensors and devices, and an entire world of competing data analytics platforms. To some this appears to be chaos. In this power panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, Bradley Holt, Developer Advocate a...
Jun. 26, 2016 08:45 AM EDT Reads: 684
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, provided an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life sett...
Jun. 25, 2016 06:15 PM EDT Reads: 986
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
Jun. 25, 2016 03:00 PM EDT Reads: 1,545
In his general session at 18th Cloud Expo, Lee Atchison, Principal Cloud Architect and Advocate at New Relic, discussed cloud as a ‘better data center’ and how it adds new capacity (faster) and improves application availability (redundancy). The cloud is a ‘Dynamic Tool for Dynamic Apps’ and resource allocation is an integral part of your application architecture, so use only the resources you need and allocate /de-allocate resources on the fly.
Jun. 25, 2016 02:15 PM EDT Reads: 1,022
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...
Jun. 25, 2016 01:45 PM EDT Reads: 883
19th Cloud Expo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy. Meanwhile, 94% of enterpri...
Jun. 25, 2016 01:15 PM EDT Reads: 1,227
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
Jun. 25, 2016 11:45 AM EDT Reads: 1,175
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 19th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devices - comp...
Jun. 25, 2016 11:15 AM EDT Reads: 1,193
Machine Learning helps make complex systems more efficient. By applying advanced Machine Learning techniques such as Cognitive Fingerprinting, wind project operators can utilize these tools to learn from collected data, detect regular patterns, and optimize their own operations. In his session at 18th Cloud Expo, Stuart Gillen, Director of Business Development at SparkCognition, discussed how research has demonstrated the value of Machine Learning in delivering next generation analytics to imp...
Jun. 25, 2016 11:00 AM EDT Reads: 498
There is little doubt that Big Data solutions will have an increasing role in the Enterprise IT mainstream over time. Big Data at Cloud Expo - to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA - has announced its Call for Papers is open. Cloud computing is being adopted in one form or another by 94% of enterprises today. Tens of billions of new devices are being connected to The Internet of Things. And Big Data is driving this bus. An exponential increase is...
Jun. 25, 2016 11:00 AM EDT Reads: 1,289
The 19th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportuni...
Jun. 25, 2016 10:30 AM EDT Reads: 1,244
Cloud computing is being adopted in one form or another by 94% of enterprises today. Tens of billions of new devices are being connected to The Internet of Things. And Big Data is driving this bus. An exponential increase is expected in the amount of information being processed, managed, analyzed, and acted upon by enterprise IT. This amazing is not part of some distant future - it is happening today. One report shows a 650% increase in enterprise data by 2020. Other estimates are even higher....
Jun. 25, 2016 10:15 AM EDT Reads: 1,251
The cloud market growth today is largely in public clouds. While there is a lot of spend in IT departments in virtualization, these aren’t yet translating into a true “cloud” experience within the enterprise. What is stopping the growth of the “private cloud” market? In his general session at 18th Cloud Expo, Nara Rajagopalan, CEO of Accelerite, explored the challenges in deploying, managing, and getting adoption for a private cloud within an enterprise. What are the key differences between wh...
Jun. 25, 2016 10:00 AM EDT Reads: 678
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo Silicon Valley Call for Papers is now open.
Jun. 25, 2016 09:30 AM EDT Reads: 1,086
It is one thing to build single industrial IoT applications, but what will it take to build the Smart Cities and truly society changing applications of the future? The technology won’t be the problem, it will be the number of parties that need to work together and be aligned in their motivation to succeed. In his Day 2 Keynote at @ThingsExpo, Henrik Kenani Dahlgren, Portfolio Marketing Manager at Ericsson, discussed how to plan to cooperate, partner, and form lasting all-star teams to change t...
Jun. 25, 2016 07:45 AM EDT Reads: 1,063
Connected devices and the industrial internet are growing exponentially every year with Cisco expecting 50 billion devices to be in operation by 2020. In this period of growth, location-based insights are becoming invaluable to many businesses as they adopt new connected technologies. Knowing when and where these devices connect from is critical for a number of scenarios in supply chain management, disaster management, emergency response, M2M, location marketing and more. In his session at @Th...
Jun. 25, 2016 07:30 AM EDT Reads: 887
SYS-CON Events announced today that ReadyTalk, a leading provider of online conferencing and webinar services, has been named Vendor Presentation Sponsor at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. ReadyTalk delivers audio and web conferencing services that inspire collaboration and enable the Future of Work for today’s increasingly digital and mobile workforce. By combining intuitive, innovative tec...
Jun. 24, 2016 01:00 PM EDT Reads: 1,334
Amazon has gradually rolled out parts of its IoT offerings, but these are just the tip of the iceberg. In addition to optimizing their backend AWS offerings, Amazon is laying the ground work to be a major force in IoT - especially in the connected home and office. In his session at @ThingsExpo, Chris Kocher, founder and managing director of Grey Heron, explained how Amazon is extending its reach to become a major force in IoT by building on its dominant cloud IoT platform, its Dash Button strat...
Jun. 24, 2016 12:00 PM EDT Reads: 1,596
industrial company for a multi-year contract initially valued at over $4.0 million. In addition to DataV software, Bsquare will also provide comprehensive systems integration, support and maintenance services. DataV leverages advanced data analytics, predictive reasoning, data-driven diagnostics, and automated orchestration of remediation actions in order to improve asset uptime while reducing service and warranty costs.
Jun. 22, 2016 11:00 AM EDT Reads: 1,353
Vidyo, Inc., has joined the Alliance for Open Media. The Alliance for Open Media is a non-profit organization working to define and develop media technologies that address the need for an open standard for video compression and delivery over the web. As a member of the Alliance, Vidyo will collaborate with industry leaders in pursuit of an open and royalty-free AOMedia Video codec, AV1. Vidyo’s contributions to the organization will bring to bear its long history of expertise in codec technolo...
Jun. 19, 2016 12:45 PM EDT Reads: 1,247