|By PR Newswire||
|November 13, 2012 07:25 AM EST||
PITTSBURGH, Nov. 13, 2012 /PRNewswire/ -- Building upon its comprehensive portfolio of advanced multiphysics engineering simulation technology, ANSYS (NASDAQ: ANSS) today released version 14.5 to further support an integrated and streamlined approach to design exploration and the creation of a complete virtual prototype. New multiphysics capabilities are seamlessly brought together with the ANSYS Workbench platform to deliver unmatched engineering productivity and innovation.
In the real world, product performance varies by operating conditions, consumer usage, manufacturing processes and material properties. As products become increasingly complex, it is more challenging for engineers to fully understand the performance implications of design variations. Multiphysics simulation technology enables companies to make informed decisions based on insight gained from these analyses to deliver optimal results. Built on a platform that streamlines workflow among simulation applications, ANSYS 14.5 delivers many new and critical multiphysics solutions, enhancements to pre-processing and meshing capabilities as well as a new parametric high-performance computing (HPC) licensing model to make design exploration more scalable.
"It's no secret that while today's products are getting smarter, they're also becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers."
NEW PARAMETRIC LICENSING SOLUTIONS FOR DESIGN EXPLORATION
ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports robust design exploration via a combination of Workbench's enhanced parametric simulation technology with improved job management and a new HPC licensing solution that enables scalable throughput computing.
Specifically, the new HPC Parametric Pack amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing), enabling simultaneous execution of multiple design points while consuming just one set of application licenses.
CHIP–PACKAGE–SYSTEM DESIGN FLOW
To meet increasing market demands of higher performance, smaller size and lower-cost electronics, the design of electronic chips, packages and systems requires an integrated analysis and verification methodology. To resolve these challenges, ANSYS 14.5 introduces the first chip–package–system (CPS) design flow on the market. This coupled approach addresses multidisciplinary requirements from the first phase of the design process and results in a final product whose individual components work together as an integrated system.
ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's integrated circuit (IC) power analysis products to ANSYS' electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave™ to IC power simulations in Apache's RedHawk™ and Totem™ for increased convenience.
ADVANCED MESHING SOLUTIONS
Users of ANSYS 14.5 can create higher-fidelity simulation results faster. ANSYS TGrid™ functionalities are integrated in the ANSYS Fluent® environment in version 14.5 to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment. Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time.
COMPLEX 3-D COMPOSITES SHAPE SIMULATION
The use of composites parts across different industries is growing due to their ability to reduce the weight of a product. While many composites can be efficiently modeled as thin structures, some complex geometries, such as turbine blades, pressure vessels and automotive structures, require the setup of 3-D models and their inclusion within larger assemblies made of non-composites parts. ANSYS Workbench provides the necessary framework and streamlined workflow in version 14.5 to further improve the ability to create 3-D layered composites from complex geometry and conveniently combine them with non-composites parts in global assemblies.
EXTENDED FLUID–THERMAL MULTIPHYSICS CAPABILITIES
Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces extended fluid–thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell®. The ANSYS Workbench platform supports the efficient coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers.
A holistic solution for one-way thermal–fluid–structure interaction (FSI), ANSYS system coupling supports a wide variety of one-way thermal FSI workflows, which promotes higher-fidelity simulations. Furthermore, the robustness of coupled two-way force/displacement FSI is enhanced, allowing engineers to gain insight into their complete products more quickly and with less hassle. A global liquid food packaging and processing leader, Tetra Pak, has seen marked improvements with 14.5's new two-way FSI capabilities:
"Historically, simulating two-way FSI has been an incredibly time-consuming and complex process and, in some applications, not even possible," said Ulf Lindblad, technology specialist at Tetra Pak. "The solution stabilization algorithm implemented in ANSYS 14.5 broadens the range of applications where we can execute this difficult task with increased accuracy and efficiency. Designing our systems with optimized FSI will ultimately lead to improved machine performance for our customers and improved package performance for their consumers."
ESTEREL TECHNOLOGIES SCADE SUITE® COUPLING WITH ANSYS SIMPLORER®
A systems-level engineering approach that brings hardware and software together earlier in the design process is crucial to avoiding design errors being introduced at a point when changes are costly.
With the integration of recently acquired ANSYS subsidiary Esterel Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical and fluidic subsystems. This capability increases the design fidelity and boosts confidence that products will perform as expected in the real world.
ANSYS HFSS™ FOR ECAD INTEGRATION
As companies face pressure to do more with their current engineering resources, ANSYS 14.5 further streamlines the design workflow and introduces ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.
Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC, has chosen to switch to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a competitor's electromagnetic modeling and simulation products for nearly 10 years. "After a two-year extensive evaluation and measurement correlation of the ANSYS tools against multiple industry products, the measurement comparisons have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures. We found through detailed measurement testing that HFSS is truly the 'golden standard' in electromagnetic modeling. When the structures we measured were modeled faithfully and the material properties were characterized and entered accurately, ANSYS HFSS produced extremely accurate results with no discernible difference between measured and modeled results."
ANSYS version 14.5 is available for download via the ANSYS Customer Portal: https://www1.ansys.com/customer/default.asp
Related images are available for download by the media at: http://www.ansys.com/newsimages
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs approximately 2,400 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 65 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
SOURCE ANSYS, Inc.
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo Silicon Valley Call for Papers is now open.
Sep. 28, 2016 04:15 AM EDT Reads: 4,575
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
Sep. 28, 2016 03:30 AM EDT Reads: 3,108
SYS-CON Events announced today that ReadyTalk, a leading provider of online conferencing and webinar services, has been named Vendor Presentation Sponsor at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. ReadyTalk delivers audio and web conferencing services that inspire collaboration and enable the Future of Work for today’s increasingly digital and mobile workforce. By combining intuitive, innovative tec...
Sep. 28, 2016 03:15 AM EDT Reads: 2,978
There is growing need for data-driven applications and the need for digital platforms to build these apps. In his session at 19th Cloud Expo, Muddu Sudhakar, VP and GM of Security & IoT at Splunk, will cover different PaaS solutions and Big Data platforms that are available to build applications. In addition, AI and machine learning are creating new requirements that developers need in the building of next-gen apps. The next-generation digital platforms have some of the past platform needs a...
Sep. 28, 2016 03:00 AM EDT Reads: 1,828
Almost two-thirds of companies either have or soon will have IoT as the backbone of their business in 2016. However, IoT is far more complex than most firms expected. How can you not get trapped in the pitfalls? In his session at @ThingsExpo, Tony Shan, a renowned visionary and thought leader, will introduce a holistic method of IoTification, which is the process of IoTifying the existing technology and business models to adopt and leverage IoT. He will drill down to the components in this fra...
Sep. 28, 2016 03:00 AM EDT Reads: 1,777
SYS-CON Events announced today that Pulzze Systems will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Pulzze Systems, Inc. provides infrastructure products for the Internet of Things to enable any connected device and system to carry out matched operations without programming. For more information, visit http://www.pulzzesystems.com.
Sep. 28, 2016 02:45 AM EDT Reads: 1,881
I'm a lonely sensor. I spend all day telling the world how I'm feeling, but none of the other sensors seem to care. I want to be connected. I want to build relationships with other sensors to be more useful for my human. I want my human to understand that when my friends next door are too hot for a while, I'll soon be flaming. And when all my friends go outside without me, I may be left behind. Don't just log my data; use the relationship graph. In his session at @ThingsExpo, Ryan Boyd, Engi...
Sep. 28, 2016 02:15 AM EDT Reads: 1,338
The Transparent Cloud-computing Consortium (abbreviation: T-Cloud Consortium) will conduct research activities into changes in the computing model as a result of collaboration between "device" and "cloud" and the creation of new value and markets through organic data processing High speed and high quality networks, and dramatic improvements in computer processing capabilities, have greatly changed the nature of applications and made the storing and processing of data on the network commonplace.
Sep. 28, 2016 02:00 AM EDT Reads: 1,135
From wearable activity trackers to fantasy e-sports, data and technology are transforming the way athletes train for the game and fans engage with their teams. In his session at @ThingsExpo, will present key data findings from leading sports organizations San Francisco 49ers, Orlando Magic NBA team. By utilizing data analytics these sports orgs have recognized new revenue streams, doubled its fan base and streamlined costs at its stadiums. John Paul is the CEO and Founder of VenueNext. Prior ...
Sep. 28, 2016 01:45 AM EDT Reads: 3,038
In his general session at 18th Cloud Expo, Lee Atchison, Principal Cloud Architect and Advocate at New Relic, discussed cloud as a ‘better data center’ and how it adds new capacity (faster) and improves application availability (redundancy). The cloud is a ‘Dynamic Tool for Dynamic Apps’ and resource allocation is an integral part of your application architecture, so use only the resources you need and allocate /de-allocate resources on the fly.
Sep. 28, 2016 01:45 AM EDT Reads: 2,791
SYS-CON Events announced today that Numerex Corp, a leading provider of managed enterprise solutions enabling the Internet of Things (IoT), will exhibit at the 19th International Cloud Expo | @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Numerex Corp. (NASDAQ:NMRX) is a leading provider of managed enterprise solutions enabling the Internet of Things (IoT). The Company's solutions produce new revenue streams or create operating...
Sep. 28, 2016 01:30 AM EDT Reads: 2,033
WebRTC adoption has generated a wave of creative uses of communications and collaboration through websites, sales apps, customer care and business applications. As WebRTC has become more mainstream it has evolved to use cases beyond the original peer-to-peer case, which has led to a repeating requirement for interoperability with existing infrastructures. In his session at @ThingsExpo, Graham Holt, Executive Vice President of Daitan Group, will cover implementation examples that have enabled ea...
Sep. 28, 2016 01:00 AM EDT Reads: 1,564
IoT offers a value of almost $4 trillion to the manufacturing industry through platforms that can improve margins, optimize operations & drive high performance work teams. By using IoT technologies as a foundation, manufacturing customers are integrating worker safety with manufacturing systems, driving deep collaboration and utilizing analytics to exponentially increased per-unit margins. However, as Benoit Lheureux, the VP for Research at Gartner points out, “IoT project implementers often ...
Sep. 27, 2016 10:45 PM EDT Reads: 3,413
The Jevons Paradox suggests that when technological advances increase efficiency of a resource, it results in an overall increase in consumption. Writing on the increased use of coal as a result of technological improvements, 19th-century economist William Stanley Jevons found that these improvements led to the development of new ways to utilize coal. In his session at 19th Cloud Expo, Mark Thiele, Chief Strategy Officer for Apcera, will compare the Jevons Paradox to modern-day enterprise IT, e...
Sep. 27, 2016 10:30 PM EDT Reads: 2,200
Complete Internet of Things (IoT) embedded device security is not just about the device but involves the entire product’s identity, data and control integrity, and services traversing the cloud. A device can no longer be looked at as an island; it is a part of a system. In fact, given the cross-domain interactions enabled by IoT it could be a part of many systems. Also, depending on where the device is deployed, for example, in the office building versus a factory floor or oil field, security ha...
Sep. 27, 2016 09:30 PM EDT Reads: 503
SYS-CON Events announced today the Enterprise IoT Bootcamp, being held November 1-2, 2016, in conjunction with 19th Cloud Expo | @ThingsExpo at the Santa Clara Convention Center in Santa Clara, CA. Combined with real-world scenarios and use cases, the Enterprise IoT Bootcamp is not just based on presentations but with hands-on demos and detailed walkthroughs. We will introduce you to a variety of real world use cases prototyped using Arduino, Raspberry Pi, BeagleBone, Spark, and Intel Edison. Y...
Sep. 27, 2016 09:30 PM EDT Reads: 2,981
Is your aging software platform suffering from technical debt while the market changes and demands new solutions at a faster clip? It’s a bold move, but you might consider walking away from your core platform and starting fresh. ReadyTalk did exactly that. In his General Session at 19th Cloud Expo, Michael Chambliss, Head of Engineering at ReadyTalk, will discuss why and how ReadyTalk diverted from healthy revenue and over a decade of audio conferencing product development to start an innovati...
Sep. 27, 2016 08:30 PM EDT Reads: 2,050
Fifty billion connected devices and still no winning protocols standards. HTTP, WebSockets, MQTT, and CoAP seem to be leading in the IoT protocol race at the moment but many more protocols are getting introduced on a regular basis. Each protocol has its pros and cons depending on the nature of the communications. Does there really need to be only one protocol to rule them all? Of course not. In his session at @ThingsExpo, Chris Matthieu, co-founder and CTO of Octoblu, walk you through how Oct...
Sep. 27, 2016 08:15 PM EDT Reads: 2,246
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
Sep. 27, 2016 07:00 PM EDT Reads: 2,886
Identity is in everything and customers are looking to their providers to ensure the security of their identities, transactions and data. With the increased reliance on cloud-based services, service providers must build security and trust into their offerings, adding value to customers and improving the user experience. Making identity, security and privacy easy for customers provides a unique advantage over the competition.
Sep. 27, 2016 06:30 PM EDT Reads: 3,581