|By PR Newswire||
|November 13, 2012 07:25 AM EST||
PITTSBURGH, Nov. 13, 2012 /PRNewswire/ -- Building upon its comprehensive portfolio of advanced multiphysics engineering simulation technology, ANSYS (NASDAQ: ANSS) today released version 14.5 to further support an integrated and streamlined approach to design exploration and the creation of a complete virtual prototype. New multiphysics capabilities are seamlessly brought together with the ANSYS Workbench platform to deliver unmatched engineering productivity and innovation.
In the real world, product performance varies by operating conditions, consumer usage, manufacturing processes and material properties. As products become increasingly complex, it is more challenging for engineers to fully understand the performance implications of design variations. Multiphysics simulation technology enables companies to make informed decisions based on insight gained from these analyses to deliver optimal results. Built on a platform that streamlines workflow among simulation applications, ANSYS 14.5 delivers many new and critical multiphysics solutions, enhancements to pre-processing and meshing capabilities as well as a new parametric high-performance computing (HPC) licensing model to make design exploration more scalable.
"It's no secret that while today's products are getting smarter, they're also becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers."
NEW PARAMETRIC LICENSING SOLUTIONS FOR DESIGN EXPLORATION
ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports robust design exploration via a combination of Workbench's enhanced parametric simulation technology with improved job management and a new HPC licensing solution that enables scalable throughput computing.
Specifically, the new HPC Parametric Pack amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing), enabling simultaneous execution of multiple design points while consuming just one set of application licenses.
CHIP–PACKAGE–SYSTEM DESIGN FLOW
To meet increasing market demands of higher performance, smaller size and lower-cost electronics, the design of electronic chips, packages and systems requires an integrated analysis and verification methodology. To resolve these challenges, ANSYS 14.5 introduces the first chip–package–system (CPS) design flow on the market. This coupled approach addresses multidisciplinary requirements from the first phase of the design process and results in a final product whose individual components work together as an integrated system.
ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's integrated circuit (IC) power analysis products to ANSYS' electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave™ to IC power simulations in Apache's RedHawk™ and Totem™ for increased convenience.
ADVANCED MESHING SOLUTIONS
Users of ANSYS 14.5 can create higher-fidelity simulation results faster. ANSYS TGrid™ functionalities are integrated in the ANSYS Fluent® environment in version 14.5 to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment. Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time.
COMPLEX 3-D COMPOSITES SHAPE SIMULATION
The use of composites parts across different industries is growing due to their ability to reduce the weight of a product. While many composites can be efficiently modeled as thin structures, some complex geometries, such as turbine blades, pressure vessels and automotive structures, require the setup of 3-D models and their inclusion within larger assemblies made of non-composites parts. ANSYS Workbench provides the necessary framework and streamlined workflow in version 14.5 to further improve the ability to create 3-D layered composites from complex geometry and conveniently combine them with non-composites parts in global assemblies.
EXTENDED FLUID–THERMAL MULTIPHYSICS CAPABILITIES
Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces extended fluid–thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell®. The ANSYS Workbench platform supports the efficient coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers.
A holistic solution for one-way thermal–fluid–structure interaction (FSI), ANSYS system coupling supports a wide variety of one-way thermal FSI workflows, which promotes higher-fidelity simulations. Furthermore, the robustness of coupled two-way force/displacement FSI is enhanced, allowing engineers to gain insight into their complete products more quickly and with less hassle. A global liquid food packaging and processing leader, Tetra Pak, has seen marked improvements with 14.5's new two-way FSI capabilities:
"Historically, simulating two-way FSI has been an incredibly time-consuming and complex process and, in some applications, not even possible," said Ulf Lindblad, technology specialist at Tetra Pak. "The solution stabilization algorithm implemented in ANSYS 14.5 broadens the range of applications where we can execute this difficult task with increased accuracy and efficiency. Designing our systems with optimized FSI will ultimately lead to improved machine performance for our customers and improved package performance for their consumers."
ESTEREL TECHNOLOGIES SCADE SUITE® COUPLING WITH ANSYS SIMPLORER®
A systems-level engineering approach that brings hardware and software together earlier in the design process is crucial to avoiding design errors being introduced at a point when changes are costly.
With the integration of recently acquired ANSYS subsidiary Esterel Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical and fluidic subsystems. This capability increases the design fidelity and boosts confidence that products will perform as expected in the real world.
ANSYS HFSS™ FOR ECAD INTEGRATION
As companies face pressure to do more with their current engineering resources, ANSYS 14.5 further streamlines the design workflow and introduces ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.
Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC, has chosen to switch to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a competitor's electromagnetic modeling and simulation products for nearly 10 years. "After a two-year extensive evaluation and measurement correlation of the ANSYS tools against multiple industry products, the measurement comparisons have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures. We found through detailed measurement testing that HFSS is truly the 'golden standard' in electromagnetic modeling. When the structures we measured were modeled faithfully and the material properties were characterized and entered accurately, ANSYS HFSS produced extremely accurate results with no discernible difference between measured and modeled results."
ANSYS version 14.5 is available for download via the ANSYS Customer Portal: https://www1.ansys.com/customer/default.asp
Related images are available for download by the media at: http://www.ansys.com/newsimages
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs approximately 2,400 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 65 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
SOURCE ANSYS, Inc.
SYS-CON Events announced today that IoT Now has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. IoT Now explores the evolving opportunities and challenges facing CSPs, and it passes on some lessons learned from those who have taken the first steps in next-gen IoT services.
Mar. 26, 2017 03:30 AM EDT Reads: 3,837
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
Mar. 26, 2017 03:15 AM EDT Reads: 1,027
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex softw...
Mar. 26, 2017 01:45 AM EDT Reads: 3,719
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
Mar. 26, 2017 12:30 AM EDT Reads: 1,895
What sort of WebRTC based applications can we expect to see over the next year and beyond? One way to predict development trends is to see what sorts of applications startups are building. In his session at @ThingsExpo, Arin Sime, founder of WebRTC.ventures, will discuss the current and likely future trends in WebRTC application development based on real requests for custom applications from real customers, as well as other public sources of information,
Mar. 26, 2017 12:15 AM EDT Reads: 754
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
Mar. 26, 2017 12:00 AM EDT Reads: 1,737
As businesses adopt functionalities in cloud computing, it’s imperative that IT operations consistently ensure cloud systems work correctly – all of the time, and to their best capabilities. In his session at @BigDataExpo, Bernd Harzog, CEO and founder of OpsDataStore, will present an industry answer to the common question, “Are you running IT operations as efficiently and as cost effectively as you need to?” He will expound on the industry issues he frequently came up against as an analyst, and...
Mar. 26, 2017 12:00 AM EDT Reads: 4,134
My team embarked on building a data lake for our sales and marketing data to better understand customer journeys. This required building a hybrid data pipeline to connect our cloud CRM with the new Hadoop Data Lake. One challenge is that IT was not in a position to provide support until we proved value and marketing did not have the experience, so we embarked on the journey ourselves within the product marketing team for our line of business within Progress. In his session at @BigDataExpo, Sum...
Mar. 25, 2017 08:45 PM EDT Reads: 2,799
Apache Hadoop is emerging as a distributed platform for handling large and fast incoming streams of data. Predictive maintenance, supply chain optimization, and Internet-of-Things analysis are examples where Hadoop provides the scalable storage, processing, and analytics platform to gain meaningful insights from granular data that is typically only valuable from a large-scale, aggregate view. One architecture useful for capturing and analyzing streaming data is the Lambda Architecture, represent...
Mar. 25, 2017 08:45 PM EDT Reads: 6,024
Things are changing so quickly in IoT that it would take a wizard to predict which ecosystem will gain the most traction. In order for IoT to reach its potential, smart devices must be able to work together. Today, there are a slew of interoperability standards being promoted by big names to make this happen: HomeKit, Brillo and Alljoyn. In his session at @ThingsExpo, Adam Justice, vice president and general manager of Grid Connect, will review what happens when smart devices don’t work togethe...
Mar. 25, 2017 06:15 PM EDT Reads: 2,576
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
Mar. 25, 2017 05:15 PM EDT Reads: 1,965
In his session at @ThingsExpo, Eric Lachapelle, CEO of the Professional Evaluation and Certification Board (PECB), will provide an overview of various initiatives to certifiy the security of connected devices and future trends in ensuring public trust of IoT. Eric Lachapelle is the Chief Executive Officer of the Professional Evaluation and Certification Board (PECB), an international certification body. His role is to help companies and individuals to achieve professional, accredited and worldw...
Mar. 25, 2017 04:00 PM EDT Reads: 560
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
Mar. 25, 2017 01:45 PM EDT Reads: 3,315
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
Mar. 25, 2017 01:30 PM EDT Reads: 1,754
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
Mar. 25, 2017 01:15 PM EDT Reads: 2,059
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
Mar. 25, 2017 12:45 PM EDT Reads: 1,913
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
Mar. 25, 2017 12:30 PM EDT Reads: 5,073
SYS-CON Events announced today that CrowdReviews.com has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. CrowdReviews.com is a transparent online platform for determining which products and services are the best based on the opinion of the crowd. The crowd consists of Internet users that have experienced products and services first-hand and have an interest in letting other potential buyers...
Mar. 25, 2017 11:00 AM EDT Reads: 3,571
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
Mar. 25, 2017 10:45 AM EDT Reads: 2,126
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
Mar. 25, 2017 10:00 AM EDT Reads: 2,959