Welcome!

Apache Authors: Liz McMillan, Pat Romanski, Elizabeth White, Christopher Harrold, Janakiram MSV

News Feed Item

MSC Embedded Announces New Qseven Module With Quad-Core ARM Cortex(TM)-A9

SAN BRUNO, CA -- (Marketwire) -- 11/29/12 -- MSC Embedded Inc., manufacturer of highly integrated standard board level products and customer-specific boards and systems, today introduced the new MSC Q7-IMX6, a low power, high performance embedded module with strong graphics capabilities. The module is offered with three different processor versions and may be used for single-core, dual-core or even quad-core computing. This multi-mode capability gives new meaning to the often quoted concept of "scalable performance" for embedded boards.

The new Qseven module MSC Q7-IMX6 uses the ARM processor Freescale i.MX6 which contains a Cortex-A9 RISC CPU with one, two or even four cores. These processors are fully compatible with each other, so they can be alternatively soldered on the same boards. Even though the processor consumes very little power, it provides high computing performance at up to 1.2 GHz clock rates, accompanied by powerful graphics capabilities. All models except the single-core version provide the Freescale Triple Play graphics architecture which consists of decoder hardware for (dual-stream) 3D videos up to Full-HD resolution (1080p). Up to four shaders with a combined power of up to 200MT/s achieve excellent 3D graphics results, a separate 2D BLT engine accelerates user interface speeds, and an additional 2D OpenVG engine drives vector-based graphics.

The module provides two banks of DDR3 DRAMs supporting between 512MB and 4GB of memory. Additionally, a 128MB NOR Flash device stores the boot loader while an optional NAND Flash memory (up to 8GB) can be used as a Flash Disk. On top of this, a SATA-II interface up to 3Gbps is available to support external data and program storage.

Among the Qseven interface set there are two USB 2.0 interfaces of which one may be host or client. An optionally populated hub device increases the number of USB interfaces to eight, so that all USB ports in the Qseven standard can be supported. PCI-Express x1 is provided as well as Gigabit Ethernet and AC'97 audio, along with busses such as CAN, SMBus, I2C and SPI. The HDMI V1.4 graphics output supports resolutions up to 1920 x 1200 (WUXGA) as well as dual-channel LVDS with 18 or 24 bits. These LVDS channels may alternatively be used as two different single-channel LVDS outputs for resolutions up to 1280 x 720 each. The internal graphics controller of the i.MX6 supports parallel operation of three different independent monitors so that each attachable screen can display different content.

MSC has provided a feature connector for interfaces not contained in the signal scheme of the Qseven connector. It can be accessed on the module and provides an additional UART next to SPI, MIPI-CSI and a BT.656 Camera interface.

Said Wolfgang Eisenbarth, VP Marketing, Embedded Computer Technology, MSC Vertriebs GmbH, "Despite its high computing and graphics performance and the multitude of functions, the MSC Q7-IMX6 consumes only 5 Watts of power. Moreover, all module variants will be available in the full industrial temperature rating, and as part of our embedded product portfolio, MSC will keep the module available for at least seven years."

The MSC Q7-IMX6 will be accompanied by driver and BSP support for Linux and Windows Embedded Compact 7 with further operating systems to follow. MSC can provide a compact baseboard (MSC Q7-MB-EP4) for evaluation and test of the module. The Qseven Reference Platform (MSC Q7-MB-RP2) is already available in the ATX format and represents an ideal development environment. At the time of sample availability, MSC will also offer ready-to-run starter kits for the MSC Q7-IMX6.

The new Qseven module covers a broad band of computing performance resulting from the choice of available CPU devices. Therefore, it may be used for a wide range of applications. For example, it is well suited for HMI applications (Human-Machine-Interfaces) in which it is responsible for the graphical representation of the human user interface. Similar applications can be found in medical systems, control stations in home automation or display systems in POS (Point of Sales). Due to the high graphics performance, the module can also be used in applications from Point-of-Information (POI) up to large "Digital Signage" displays. Since the module will also be available in the extended temperature range, it is well suited for all kinds of industrial applications, and due to its low power consumption it can also be used for portable, battery-powered applications.

Pricing and Availability
First samples will become available in January, 2013. The quad-core version will be priced around $180 in medium volumes.

MSC Embedded Inc.
MSC Embedded Inc. is a manufacturer of board-level products and customer specific industrial embedded computers. Products include COM Express ™, Qseven and ETX ® as well as products that interface to COM modules like carrier boards, I/O technologies for displays or other process interfaces. MSC Embedded also offers custom BIOS adaptation, BSP and device drivers for all its products to OEM customers worldwide. The company's headquarters is based in San Bruno, CA and Stutensee, Germany. For more information, visit www.mscembedded.com

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2167793

Press Contacts:

Michael Miller
Direct: (650) 616 4068
Fax: (650) 616 4001
Email: Email Contact
www.mscembedded.com

Andrea Vedanayagam
Veda Communications
(408) 656-4494
Email Contact

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
In his session at @ThingsExpo, Eric Lachapelle, CEO of the Professional Evaluation and Certification Board (PECB), will provide an overview of various initiatives to certifiy the security of connected devices and future trends in ensuring public trust of IoT. Eric Lachapelle is the Chief Executive Officer of the Professional Evaluation and Certification Board (PECB), an international certification body. His role is to help companies and individuals to achieve professional, accredited and worldw...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that CrowdReviews.com has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. CrowdReviews.com is a transparent online platform for determining which products and services are the best based on the opinion of the crowd. The crowd consists of Internet users that have experienced products and services first-hand and have an interest in letting other potential buyers...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
SYS-CON Events announced today that Telecom Reseller has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.
"I think that everyone recognizes that for IoT to really realize its full potential and value that it is about creating ecosystems and marketplaces and that no single vendor is able to support what is required," explained Esmeralda Swartz, VP, Marketing Enterprise and Cloud at Ericsson, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
In his keynote at @ThingsExpo, Chris Matthieu, Director of IoT Engineering at Citrix and co-founder and CTO of Octoblu, focused on building an IoT platform and company. He provided a behind-the-scenes look at Octoblu’s platform, business, and pivots along the way (including the Citrix acquisition of Octoblu).
SYS-CON Events announced today that HTBase will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. HTBase (Gartner 2016 Cool Vendor) delivers a Composable IT infrastructure solution architected for agility and increased efficiency. It turns compute, storage, and fabric into fluid pools of resources that are easily composed and re-composed to meet each application’s needs. With HTBase, companies can quickly prov...
Web Real-Time Communication APIs have quickly revolutionized what browsers are capable of. In addition to video and audio streams, we can now bi-directionally send arbitrary data over WebRTC's PeerConnection Data Channels. With the advent of Progressive Web Apps and new hardware APIs such as WebBluetooh and WebUSB, we can finally enable users to stitch together the Internet of Things directly from their browsers while communicating privately and securely in a decentralized way.