Welcome!

Apache Authors: Liz McMillan, Pat Romanski, Elizabeth White, Christopher Harrold, Janakiram MSV

News Feed Item

AMD Embeds Intelligent, Interactive and Immersive Experiences With 2nd Generation AMD Embedded R-Series APUs and CPUs

New "Bald Eagle" Platform Delivers Unmatched Compute and Graphics Performance Targeting Gaming Machines, Medical Imaging, Digital Signage and Other Embedded Applications

MACAO, CHINA -- (Marketwired) -- 05/20/14 -- G2E -- AMD (NYSE: AMD) today announced the 2nd generation AMD Embedded R-series accelerated processing unit (APU) and CPU family (previously codenamed "Bald Eagle") for embedded applications. The new solutions are targeted at gaming machines, medical imaging, digital signage, industrial control and automation (IC&A), communications and networking infrastructure that require industry-leading compute and graphics processing technology.

"When it comes to compute performance, graphics performance and performance-per-watt, the 2nd generation AMD Embedded R-series family is unique in the embedded market," said Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions. "The addition of HSA, GCN and power management features enables our customers to create a new world of intelligent, interactive and immersive embedded devices."

The 2nd generation AMD R-series APU and CPU solutions are designed for mid- to high-end visual and parallel compute-intensive embedded applications with support for Linux, RTOS and Windows operating systems. The new solutions range from 2.2-3.6 GHz CPU frequency with max boost, based on AMD's latest CPU architecture (codenamed: "Steamroller") and 533-686 MHz GPU frequency based on AMD's latest Graphics Core Next (GCN) architecture, designed to advance the visual growth and parallel processing capabilities of embedded applications.

Industry-First Features, Benefits and Support

  • Heterogeneous System Architecture (HSA): The 2nd generation AMD Embedded R-series APU is the first embedded processor to incorporate HSA features, enabling applications to distribute workloads to run on the best compute element -- e.g., CPU, GPU or a specialized accelerator such as video decode -- for up to 44 percent more 3-D graphics performance(1) and up to 46 percent more compute performance than comparable Intel Haswell Core-i CPUs(2).
  • Open-source Linux development: As a gold-level member of the Yocto Project™, a Linux Foundation Collaboration Project, and as part of a recent multiyear agreement with Mentor Graphics, embedded systems developers now have access to customized embedded Linux development and commercial support on the 2nd generation AMD Embedded R-series family through Mentor Embedded Linux and Sourcery™ CodeBench, as well as Mentor Embedded Linux Lite available at no cost.
  • Embedded-specific features: The 2nd generation AMD Embedded R-series family is specifically designed for embedded applications with industry-leading, 10-year longevity(3), dual-channel memory with error-correcting code (ECC), DDR3-2133 support and configurable TDP for system design flexibility to optimize the processor at a lower TDP.

Target Markets
Visual Embedded: For embedded applications like gaming machines and digital signage that provide immersive and interactive visual experiences, AMD customers can achieve up to 64 percent more 3-D graphics performance than a standalone 2nd generation AMD Embedded R-series APU(4), and greater flexibility and scalability with support for up to nine independent displays and 4K resolution with the combination of the newly launched AMD Embedded Radeon™ E8860 discrete GPU.

Medical Imaging: The 2nd generation AMD R-series APU is also ideal for clinical and field medical imaging applications across portable, 3-D and 4-D ultrasound, low-dose X-ray, and imaging-assisted surgical systems. The new AMD Embedded R-series APUs deliver high image transformation performance and low latencies in a low-power and highly integrated solution for medical imaging device vendors looking to help reduce size, weight, complexity and system cost. The combination of high compute performance and low memory access latency afforded by hUMA, as well as high graphics performance in the 2nd generation AMD Embedded R-series platform accelerate image transformation and deliver excellent image rendering to enable next-generation ultrasound applications to help diagnose and treat patients.

Communications and Networking Infrastructure: For non-visual applications, the advanced parallel-compute graphics engine in the 2nd generation AMD Embedded R-series APU provides a highly unique heterogeneous compute platform for control plane switching and routing applications. With up to 66 percent more compute performance than the previous generation AMD Embedded R-series APU,(5) the high-performance GPU enables acceleration of parallelizable functions such as deep packet inspection, encryption or decryption, search, and compression or decompression allowing more CPU headroom for customers to help increase feature velocity.

Supporting Resources

  • Learn more about the 2nd generation AMD Embedded R-series product family
  • Blog: Radgames optimize Bink 2.0 for AMD R-series APU
  • Become a fan of AMD on Facebook
  • Follow @AMDEmbedded on Twitter
  • Join AMD on Google Plus

About AMD
AMD (NYSE: AMD) designs and integrates technology that powers millions of intelligent devices, including personal computers, tablets, game consoles and cloud servers that define the new era of surround computing. AMD solutions enable people everywhere to realize the full potential of their favorite devices and applications to push the boundaries of what is possible. For more information, visit www.amd.com.

1. The AMD RX-427BB scored 2051 and Intel Haswell Core i7-4765T scored 1424, when running 3DMark® 11P benchmark. RX-427BB's TDP is 35W and Core i7-4765T's TDP is 35W. The performance delta of 44% was calculated based on RX-427BB's performance score of 2051 and Core i7-4765T's performance score of 1424. The AMD RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The Core i7-4765T used a Lenovo ThinkCentre M93p with 8GB DDR3 memory and 128GB Crucial M4 HDD. Both systems ran Windows® 7 Ultimate. EMB-93
2. The AMD RX-427BB scored 76 and Intel Haswell Core i7-4765T scored 52, when running BasemarkCL 1.0 benchmark. RX-427BB's TDP is 35W and Core i7-4765T's TDP is 35W. The performance delta of 46% was calculated based on RX-427BB's performance score of 76 and Core i7-4765T's performance score of 52. The AMD RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The Core i7-4765T used a Lenovo ThinkCentre M93p with 8GB DDR3 memory and 128GB Crucial M4 HDD. Both systems ran Windows® 7 Ultimate. EMB-94
3. Part availability is planned for 10 years from date of announcement, subject to change without notice. Further support available under contract
4. The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and RX-427BB. The system ran Windows® 7 Ultimate. EMB-97
5. The AMD Bald Eagle RX-427BB scored 76 and AMD R-Series 464L scored 46, when running BasemarkCL 1.0 benchmark. The performance delta of 66% was calculated based on RX-427BB's performance score of 76 and R-464L's performance score of 46. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The R-464L used an AMD DB-FS1r2 development board with 8GB DDR3 memory and 160GB Hitachi HDD. Both systems ran Windows® 7 Ultimate. EMB-95

AMD, the AMD Arrow logo, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Mentor Graphics, Mentor, and Nucleus are trademarks of Mentor Graphics Corporation and Sourcery is a trademark of Mentor Graphics Corporation. All other company or product names are the registered trademarks of their respective owners.

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
"I think that everyone recognizes that for IoT to really realize its full potential and value that it is about creating ecosystems and marketplaces and that no single vendor is able to support what is required," explained Esmeralda Swartz, VP, Marketing Enterprise and Cloud at Ericsson, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
Why do your mobile transformations need to happen today? Mobile is the strategy that enterprise transformation centers on to drive customer engagement. In his general session at @ThingsExpo, Roger Woods, Director, Mobile Product & Strategy – Adobe Marketing Cloud, covered key IoT and mobile trends that are forcing mobile transformation, key components of a solid mobile strategy and explored how brands are effectively driving mobile change throughout the enterprise.
My team embarked on building a data lake for our sales and marketing data to better understand customer journeys. This required building a hybrid data pipeline to connect our cloud CRM with the new Hadoop Data Lake. One challenge is that IT was not in a position to provide support until we proved value and marketing did not have the experience, so we embarked on the journey ourselves within the product marketing team for our line of business within Progress. In his session at @BigDataExpo, Sum...
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex softw...
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
What sort of WebRTC based applications can we expect to see over the next year and beyond? One way to predict development trends is to see what sorts of applications startups are building. In his session at @ThingsExpo, Arin Sime, founder of WebRTC.ventures, will discuss the current and likely future trends in WebRTC application development based on real requests for custom applications from real customers, as well as other public sources of information,
China Unicom exhibit at the 19th International Cloud Expo, which took place at the Santa Clara Convention Center in Santa Clara, CA, in November 2016. China United Network Communications Group Co. Ltd ("China Unicom") was officially established in 2009 on the basis of the merger of former China Netcom and former China Unicom. China Unicom mainly operates a full range of telecommunications services including mobile broadband (GSM, WCDMA, LTE FDD, TD-LTE), fixed-line broadband, ICT, data communica...
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
Things are changing so quickly in IoT that it would take a wizard to predict which ecosystem will gain the most traction. In order for IoT to reach its potential, smart devices must be able to work together. Today, there are a slew of interoperability standards being promoted by big names to make this happen: HomeKit, Brillo and Alljoyn. In his session at @ThingsExpo, Adam Justice, vice president and general manager of Grid Connect, will review what happens when smart devices don’t work togethe...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that Auditwerx will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Auditwerx specializes in SOC 1, SOC 2, and SOC 3 attestation services throughout the U.S. and Canada. As a division of Carr, Riggs & Ingram (CRI), one of the top 20 largest CPA firms nationally, you can expect the resources, skills, and experience of a much larger firm combined with the accessibility and attent...