Welcome!

Apache Authors: Pat Romanski, Liz McMillan, Elizabeth White, Christopher Harrold, Janakiram MSV

News Feed Item

Intel(R) Atom(TM) E3800 XMC/PMC and Rugged COM Express(R) From X-ES

MIDDLETON, WI -- (Marketwired) -- 08/19/14 -- Extreme Engineering Solutions, Inc. (X-ES) introduces the XPedite8101 XMC/PMC and XPedite8150 Rugged COM Express® modules based on the Intel® Atom™ E3800 (formerly Bay Trail-I) processor family. Atom E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. They are low power system-on-chip (SoC) processors with integrated graphics and support for up to four cores operating at up to 1.91 GHz. Along with best-in-class performance-per-watt, the E3800 family supports extremely low operating temperatures, and its power-efficient 22 nm technology enables operation in the most demanding high-temperature environments.

X-ES Advantages

With Built-In Test (BIT) support, true configuration and obsolescence management, class III PCB fabrication and assembly, environmental qualification per MIL-STD-810, as well as many other features, X-ES E3800-based modules are designed and tested for maximum reliability in the most demanding environments and applications that require long life cycles. Also, instead of using a legacy BIOS-based bootloader, X-ES's E3800-based modules support industry-leading boot times and drastically simplify system security by employing Intel's Firmware Support Package (FSP) to power their open source coreboot bootloaders.

X-ES supports the Atom E3800 processor in industry-standard XMC/PMC and Rugged COM Express modules, enabling system integrators to develop a single x86-based application on modular hardware solutions that can be tailored for the performance and environmental constraints of each platform. The E3800-based XPedite8101 XMC/PMC and XPedite8150 Rugged COM Express modules are ideal for platforms with more stringent Size, Weight, Power, Cost (SWaP-C) and thermal constraints. For platforms with larger power budgets and higher performance requirements, X-ES provides a number of modules based on the latest Intel Core i7 processors, such as the XPedite7501 XMC, XPedite7570 3U VPX, XCalibur4540 6U VPX, and XPedite7450 Rugged COM Express modules.

XPedite8101 XMC/PMC

The XPedite8101 is an Intel® Atom™ E3800-based XMC/PMC available in conduction- and air-cooled configurations. It supports up to 8 GB of DDR3 ECC SDRAM and up to 32 GB of SLC NAND flash, as well as a Dual-Mode DisplayPort video interface and two Gigabit Ethernet ports. The XPedite8101's compact XMC/PMC design can be hosted on a number of other form factors, such as 3U and 6U VPX, 3U and 6U CompactPCI (cPCI), VME, and rugged Small Form Factor (SFF) systems including the XPand6200 Series.

XPedite8150 and XPedite8152 Rugged COM Express Mini

The XPedite8150 is a Rugged COM Express module based on the Intel® Atom™ E3800 series of processors. It is compliant with the COM Express Mini form factor (55 mm x 84 mm) and provides up to 4 GB of DDR3 ECC SDRAM. The XPedite8150 also supports an enhanced Type 10 pinout with one Dual-Mode DisplayPort, one Embedded DisplayPort, and two Gigabit Ethernet interfaces. The XPedite8152 provides the same SDRAM density and a compatible pinout with the XPedite8150, but it extends the size of the module to 55 mm x 109 mm to include support for up to 32 GB of SLC NAND Flash and another external SATA interface. Both the XPedite8150 and XPedite8152 can be used in the XPand6000 Series rugged Small Form Factor (SFF) systems, as well as the XPand1400 Series development systems.

Wind River VxWorks and Linux Board Support Packages, as well as Microsoft Windows drivers, are available for the XPedite8101, XPedite8150, and XPedite8152. These products support the E3827, E3826, E3815, E3845, and E3825 processors from the E3800 series. The E3800 series is the 4th generation Atom processor from Intel and was formerly known as the Bay Trail-I platform and Valleyview processor.

X-ES will be displaying our Intel® Atom™ E3800-based modules at the 2014 Intel Developer Forum (IDF14) in San Francisco, September 9th through the 11th. Stop by and visit us at IDF in booth 661 of the Intelligent Systems Community, or contact us today to find out more about using the Intel® Atom™ for your application.

About X-ES - Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A.-based company, designs and builds single board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. For further information on X-ES products or services, please visit our website: www.xes-inc.com or call (608) 833-1155.

Contact:
Jeff Porter
Director of Marketing and Product Development
+1-608-833-1155

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
In this strange new world where more and more power is drawn from business technology, companies are effectively straddling two paths on the road to innovation and transformation into digital enterprises. The first path is the heritage trail – with “legacy” technology forming the background. Here, extant technologies are transformed by core IT teams to provide more API-driven approaches. Legacy systems can restrict companies that are transitioning into digital enterprises. To truly become a lead...
SYS-CON Events announced today that CAST Software will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CAST was founded more than 25 years ago to make the invisible visible. Built around the idea that even the best analytics on the market still leave blind spots for technical teams looking to deliver better software and prevent outages, CAST provides the software intelligence that matter ...
SYS-CON Events announced today that Daiya Industry will exhibit at the Japanese Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Ruby Development Inc. builds new services in short period of time and provides a continuous support of those services based on Ruby on Rails. For more information, please visit https://github.com/RubyDevInc.
As businesses evolve, they need technology that is simple to help them succeed today and flexible enough to help them build for tomorrow. Chrome is fit for the workplace of the future — providing a secure, consistent user experience across a range of devices that can be used anywhere. In her session at 21st Cloud Expo, Vidya Nagarajan, a Senior Product Manager at Google, will take a look at various options as to how ChromeOS can be leveraged to interact with people on the devices, and formats th...
SYS-CON Events announced today that Yuasa System will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Yuasa System is introducing a multi-purpose endurance testing system for flexible displays, OLED devices, flexible substrates, flat cables, and films in smartphones, wearables, automobiles, and healthcare.
SYS-CON Events announced today that Taica will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Taica manufacturers Alpha-GEL brand silicone components and materials, which maintain outstanding performance over a wide temperature range -40C to +200C. For more information, visit http://www.taica.co.jp/english/.
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
SYS-CON Events announced today that Nihon Micron will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nihon Micron Co., Ltd. strives for technological innovation to establish high-density, high-precision processing technology for providing printed circuit board and metal mount RFID tags used for communication devices. For more inf...
Enterprises have taken advantage of IoT to achieve important revenue and cost advantages. What is less apparent is how incumbent enterprises operating at scale have, following success with IoT, built analytic, operations management and software development capabilities – ranging from autonomous vehicles to manageable robotics installations. They have embraced these capabilities as if they were Silicon Valley startups. As a result, many firms employ new business models that place enormous impor...
SYS-CON Events announced today that MIRAI Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MIRAI Inc. are IT consultants from the public sector whose mission is to solve social issues by technology and innovation and to create a meaningful future for people.
Widespread fragmentation is stalling the growth of the IIoT and making it difficult for partners to work together. The number of software platforms, apps, hardware and connectivity standards is creating paralysis among businesses that are afraid of being locked into a solution. EdgeX Foundry is unifying the community around a common IoT edge framework and an ecosystem of interoperable components.
SYS-CON Events announced today that Dasher Technologies will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Dasher Technologies, Inc. ® is a premier IT solution provider that delivers expert technical resources along with trusted account executives to architect and deliver complete IT solutions and services to help our clients execute their goals, plans and objectives. Since 1999, we'v...
SYS-CON Events announced today that TidalScale, a leading provider of systems and services, will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale has been involved in shaping the computing landscape. They've designed, developed and deployed some of the most important and successful systems and services in the history of the computing industry - internet, Ethernet, operating s...
SYS-CON Events announced today that Massive Networks, that helps your business operate seamlessly with fast, reliable, and secure internet and network solutions, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. As a premier telecommunications provider, Massive Networks is headquartered out of Louisville, Colorado. With years of experience under their belt, their team of...
SYS-CON Events announced today that IBM has been named “Diamond Sponsor” of SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California.
Infoblox delivers Actionable Network Intelligence to enterprise, government, and service provider customers around the world. They are the industry leader in DNS, DHCP, and IP address management, the category known as DDI. We empower thousands of organizations to control and secure their networks from the core-enabling them to increase efficiency and visibility, improve customer service, and meet compliance requirements.
SYS-CON Events announced today that TidalScale will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale is the leading provider of Software-Defined Servers that bring flexibility to modern data centers by right-sizing servers on the fly to fit any data set or workload. TidalScale’s award-winning inverse hypervisor technology combines multiple commodity servers (including their ass...
As hybrid cloud becomes the de-facto standard mode of operation for most enterprises, new challenges arise on how to efficiently and economically share data across environments. In his session at 21st Cloud Expo, Dr. Allon Cohen, VP of Product at Elastifile, will explore new techniques and best practices that help enterprise IT benefit from the advantages of hybrid cloud environments by enabling data availability for both legacy enterprise and cloud-native mission critical applications. By rev...
Join IBM November 1 at 21st Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Cognitive analysis impacts today’s systems with unparalleled ability that were previously available only to manned, back-end operations. Thanks to cloud processing, IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Imagine a robot vacuum that becomes your personal assistant tha...
As popularity of the smart home is growing and continues to go mainstream, technological factors play a greater role. The IoT protocol houses the interoperability battery consumption, security, and configuration of a smart home device, and it can be difficult for companies to choose the right kind for their product. For both DIY and professionally installed smart homes, developers need to consider each of these elements for their product to be successful in the market and current smart homes.